Seminar Speaker: Paul Besser, Entegris

Materials Innovations Driving Microprocessor Performance

Abstract

As microprocessor Logic Technology scales, consumers demand improved performance from generation to generation. Device manufacturers accomplish this by reducing the dimensions of the features on that processor, inserting novel architectural improvements, and introducing new materials and processes. Changing one material in the process, however, can have a cascading effect on subsequent processing steps. The development of a manufacturable process requires a fundamental understanding of these technology interactions.

This talk will focus on the metals and dielectrics that serve to connect the millions of transistors on a microprocessor chip. We will review the criticality of Capacitance and Resistance (RC) to the product performance. Lowering RC equates to higher performance. New dielectric materials are introduced to drive capacitance reduction, but these lower dielectric constant materials are weaker and sensitive to environments, making them more difficult to integrate. On the resistance side of the equation, Cu is the incumbent conductor material, but as dimensions scale to 12 nm and below, Cu resistance increases significantly. We will understand copper’s limitations and review the novel metals being introduced to lower resistance.

Biography

As a Senior Director in the Advanced Technology Engagement Team at Entegris, Paul Besser is responsible for developing the corporate logic technology roadmap and engagement strategy. Paul’s career began at Advanced Micro Devices developing novel materials innovations, becoming an AMD Fellow, and accepting assignments to IMEC, Motorola, and IBM Research. Between AMD and Entegris, Paul held technology leadership roles at Unity Semiconductor, GlobalFoundries, Lam Research, and ARM. Paul attained his B.S. in Materials Science and Engineering at NC State and holds a Ph.D. in Materials Science and Engineering from Stanford. He has co-authored over 100 research publications and holds >250 U.S. patents. He is a 2016 inductee to the MSE Hall of Fame.