Seminar Speaker: Fred Kish, NC State ECE

Heterogeneous Integration and Engineering of Compound Semiconductor Materials and Devices

Abstract

This talk will review the progress and opportunities for the heterogeneous integration and engineering of compound semiconductors materials and devices. Specifically, the development of the compound semiconductor wafer bonding technology and its first commercial deployment for the realization of high-efficiency transparent-substrate AlGaInP light-emitting diode technology. Considerations for the realization of robust, low-resistance, optically transparent, compound semiconductor wafer-bonded interfaces will be discussed. Furthermore, the discovery of the completion of high-quality oxides on Al-bearing III-V semiconductors will be reviewed. The oxides have been utilized to realize the highest-performance vertical-cavity surface-emitting lasers (VCSELs). Future opportunities for materials engineering are discussed, including a toolkit that promises to enable the realization of a visible and ultraviolet spectrum photonic IC (VU-PIC) platform. Included in this toolkit is a new technique named crystal heterogeneous integration (CHI). Crystal heterogeneous integration is an advanced form of heterogeneous integration for the direct integration of semiconductor-semiconductor interfaces that fuses the capabilities of wafer bonding and crystal growth. Early results from the utilization of this process will be presented.

Speaker Biography

Fred A. Kish, received his B.S., M.S., and Ph.D. degrees in electrical engineering from the University of Illinois at Urbana-Champaign in 1988, 1989, and 1992, respectively. His Ph.D. research work (under Nick Holonyak, Jr.) is part of the core Al-bearing III-V native-oxide technology that has enabled the development of the highest-performance VCSELs and has been licensed to VCSEL manufacturers throughout the world. From 1992-1999, he was at Hewlett-Packard where he co-invented and led the commercialization of the highest performance (efficiency) red-orange-yellow visible LEDs produced at the time (wafer-bonded transparent-substrate AlGaInP LEDs). The efficiencies of these devices exceeded those of incandescent and halogen lamps with products based on this technology resulting in over $2B in revenue to date. From 1999-2001, he was with Agilent Technologies as the III-V Department Manager. In 2001, he joined Infinera Corporation where he co-invented and led the effort to research, develop, and commercialize the first practical (commercially deployed) large-scale PICs and the first commercial fully integrated system-on-a-chip for optical communications. The large-scale InP PICs are at the core of Infinera’s optical network products and have been the enabling technology behind over $5B in PIC-based networking product sales. He served as Senior Vice President of the Optical Integrated Circuit Group at Infinera before joining NC State as the NC State Nanofabrication Facility Director. Dr. Kish is a Fellow of the National Academy of Inventors, Optica (formerly OSA) and IEEE and a member of the National Academy of Engineering. His awards include the IEEE David Sarnoff Award, the IEEE Photonics Society Quantum Electronics Award, the IEEE LEOS Engineering Achievement Award, the OSA Adolph Lomb Award, and the International Symposium on Compound Semiconductors Young Scientist Award. He has co-authored over 135 U.S. patents, more than 170 peer-reviewed journal and conference publications, and five book chapters on optoelectronic devices and materials.