FACILITIES

A) Molecular Beam Epitaxy (MBE) Deposition System

State-of-the-art, ultra-high vacuum (UHV) system for the deposition of a wide range of materials, with film thickness control to the mono-layer level. The system consists of a 10-sample load-lock chamber, a cylindrical sample-transfer chamber, and a growth chamber all designed for use with 8” diameter wafer substrates (and any size smaller is OK), making this system important for our collaborations with semiconductor chip manufacturers. The main chamber is divided into a growth section, and an upper anneal chamber. Examples of films deposited in the system include: nanometer thick amorphous lanthanum silicate as the gate dielectric for transistor scaling applications; epitaxial perovskites of the SrTiO3 family deposited on Si for advanced electronics applications; metal conductor films such as tantalum, nickel, molybdenum, and platinum. This system is located in a cleanroom environment.

Computer-controlled operation

Main shutter, and individual growth shutters can be opened and closed on a time basis, allowing multilayer growth of various material stacks.

Sources

(5) effusion cells (1000C, 1200C, and 2000C T-limits)

8-well (7cc each) e-beam evaporation source

Single hearth 40cc e-beam evaporation source

Magnetron sputtering source for low-pressure operation

Analytical RHEED

RHEED analysis of substrate and film surfaces can be monitored during epitaxial growth.

Quartz crystal rate monitoring

Multiple quartz crystals allow for precise growth rate monitoring, from sub-nm thicknesses and up.

Substrate Manipulator

Samples can be heated to ~900 C during growth, and rotated for good uniformity. Also, samples can be annealed in situ after deposition if required.

SEE MORE INFO REGARDING FILM GROWTH IN THE 'PROCESSES' SECTION

B) Quartz tube furnace

For oxidation, or forming gas anneals, of deposited materials (1.4" max width).

C) Post-processing

Various post-processing can be done as desired through the NCSU nanofabrication facility (nnf) cleanroom: patterning, etching, characterization of thickness, resistivity, etc. Please discuss your complete needs.

Monteith Engineering Research Center - Microlelectronics Center @ NCSU.